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Besi APAC Sdn Bhd

3 Jalan 26/7, Section 26, 40000 Shah Alam, Selangor Darul Ehsan, Malaysia
Tel: 60 3 5514 7777
Fax: 60 3 5192 9416
Email: info.malaysia@besi.com
Website: www.besi.com

Develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy. The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked die bonders and die sorting equipment.


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