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Advanced Interconnect Technology Ltd

1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong Kong
Tel: (852) 2719-5440
Fax: (852) 2358-4766
Email: ait@ait.com.hk
Website: www.ait.com.hk

Provide a Custom Wafer Bumping service to the semiconductor wafer fabrication and chip packaging houses. Also provides technology licencing, rapid prototyping, and a consultancy service for flip-chip-on-glass (FCOG), flip-chip-on-board (FCOB), and flip-chip-in-package (FCIP) technologies.